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Hong Kong

Central China Real Estate 6.875% 2022-08 USD

Posted by InvestopoliNews on August 8, 2019 18:23 CEST

New bond issue: Central China Real Estate (HKSE:832) issued new debt notes (XS2037190514) for 300M USD as of August 2, 2019. Tradable at Singapore Stock Exchange as of August 8, 2019. Read more


China Jinmao 5.20% 2021-03 CNY

Posted by InvestopoliNews on October 3, 2018 08:21 CEST

Update! New bond issue: China Jinmao (HKSE:817) issued new debt notes (XS1789207740) for 1.25B CNY as of March 1, 2018. Listed at Stuttgart Stock Exchange as of October 3, 2018. Read more




Bangkok Bank Hong Kong 4.45% 2028-09 USD

Posted by InvestopoliNews on September 21, 2018 12:35 CEST

Update! New bond issue: Bangkok Bank Hong Kong (SET:BBL) issued new debt notes (USY0606WBZ24, Y0606WBZ2) (144A: US059895AS10, 059895AS1) for 600M USD as of September 12, 2018. Tradable at Singapore Stock Exchange as of September 20, 2018. Read more


Bangkok Bank Hong Kong 4.05% 2024-03 USD

Posted by InvestopoliNews on September 17, 2018 07:51 CEST

New bond issue: Bangkok Bank Hong Kong (SET:BBL) issued new debt notes (USY0606WBY58, Y0606WBY5) (144A: US059895AR37, 059895AR3) for 600M USD as of September 12, 2018. Listed at Munich Stock Exchange as of September 17, 2018. Read more


Seaspan FFLR% Perpetual USD

Posted by InvestopoliNews on September 13, 2018 11:25 CEST

New bond issue: Seaspan (NYSE:SSW) issued new debt notes (MHY756381411) for 150M USD as of September 12, 2018. Read more



Nan Fung Group 5.00% 2028-09 USD

Posted by InvestopoliNews on September 6, 2018 19:23 CEST

Update! New bond issue: Nan Fung Group issued new debt notes (XS1873136607) for 500M USD as of August 28, 2018. Tradable at Singapore Stock Exchange as of September 6, 2018. Read more


China Conch Venture ZC% 2023-09 HKD

Posted by InvestopoliNews on September 6, 2018 01:16 CEST

New bond issue: China Conch Venture (HKSE:586) issued new debt notes (XS1872028177) for 3.93B HKD as of August 29, 2018. Listed at Stuttgart Stock Exchange as of September 6, 2018. Read more


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