Baidu Bond 4.875% 2028-11 USD

New bond issue: Baidu (NASDAQ:BIDU) issued new debt notes (US056752AN88, 056752AN8) for 400M USD as of November 8, 2018. Listed at TRACE OTC as of November 9, 2018.

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Baidu Bond 4.375% 2024-05 USD

New bond issue: Baidu (NASDAQ:BIDU) issued new debt notes (US056752AM06, 056752AM0) for 600M USD as of November 8, 2018. Listed at TRACE OTC as of November 9, 2018.

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Corning Bond 5.85% 2068-11 USD

Update! New bond issue: Corning (NYSE:GLW) issued new debt notes (US219350BL89, 219350BL8) for 300M USD as of October 30, 2018. Tradable at TRACE OTC as of October 31, 2018. Listed at NYSE as of November 6, 2018.

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Corning Bond 5.35% 2048-11 USD

Update! New bond issue: Corning (NYSE:GLW) issued new debt notes (US219350BK07, 219350BK0) for 550M USD as of October 30, 2018. Tradable at TRACE OTC as of October 31, 2018. Listed at NYSE as of November 6, 2018.

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Atos Bond 2.50% 2028-05 EUR

New bond issue: Atos (PEX:ATO) issued new debt notes (FR0013378460) for 350M EUR as of October 31, 2018.

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Atos Bond 1.75% 2025-05 EUR

New bond issue: Atos (PEX:ATO) issued new debt notes (FR0013378452) for 750M EUR as of October 31, 2018.

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Atos Bond 0.75% 2022-05 EUR

New bond issue: Atos (PEX:ATO) issued new debt notes (FR0013378445) for 700M EUR as of October 31, 2018.

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Corning Bond 4.70% 2037-03 USD

Update! New bond issue: Corning (NYSE:GLW) issued new debt notes (US219350AX37, 219350AX3) for 300M USD as of February 15, 2012. New tranche for 50M USD with issue date November 6, 2018.

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Akoustis Technologies Bond 6.50% 2023-11 USD

New bond issue: Akoustis Technologies (NASDAQ:AKTS) issued new debt notes (US00973NAC65, 00973NAC6) for 10M USD as of October 19, 2018. Tradable at TRACE OTC as of October 22, 2018.

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Motorola Solutions Bond 4.60% 2028-02 USD

Update! New bond issue: Motorola Solutions (NYSE:MSI) issued new debt notes (US620076BL24, 620076BL2) for 700M USD as of February 21, 2018. Tradable at TRACE OTC as of February 22, 2018. New tranche for 200M USD with issue date October 5, 2018. Listed at Stuttgart Stock Exchange as of March 1, 2018.

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DXC Technology Bond 1.75% 2026-01 EUR

Update! New bond issue: DXC Technology (NYSE:DXC) issued new debt notes (XS1883245331, 23355LAH9) for 650M EUR as of September 19, 2018. Listed at Munich Stock Exchange as of September 28, 2018.

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Splunk Bond 1.125% 2025-09 USD 144A

New bond issue: Splunk (NASDAQ:SPLK) issued new debt notes (US848637AB00, 848637AB0) for 750M USD as of September 19, 2018. Tradable at TRACE OTC as of September 19, 2018. Listed at Berlin Stock Exchange as of September 21, 2018.

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Splunk Bond 0.50% 2023-09 USD 144A

New bond issue: Splunk (NASDAQ:SPLK) issued new debt notes (US848637AA27, 848637AA2) for 1.1B USD as of September 19, 2018. Tradable at TRACE OTC as of September 19, 2018.

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InterXion Bond 4.75% 2025-06 EUR

Update! New bond issue: InterXion (NYSE:INXN) issued new debt notes (XS1838072426) for 1.2B EUR as of June 11, 2018. New tranche for 200K EUR with issue date September 18, 2018.

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DocuSign Bond 0.50% 2023-09 USD 144A

New bond issue: DocuSign (NASDAQ:DOCU) issued new debt notes (US256163AA41, 256163AA4) for 500M USD as of September 14, 2018. Tradable at TRACE OTC as of September 14, 2018. Listed at Berlin Stock Exchange as of September 20, 2018.

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Hewlett Packard Enterprise Bond VR% 2021-10 USD

Update! New bond issue: Hewlett Packard Enterprise (NYSE:HPQ) issued new debt notes (US42824CBB46, 42824CBB4) for 800M USD as of September 10, 2018. Tradable at TRACE OTC as of September 11, 2018. Listed at Munich Stock Exchange as of September 20, 2018.

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Amadeus IT Group Bond 1.50% 2026-09 EUR

Update! New bond issue: Amadeus IT Group (BME:AMS) issued new debt notes (XS1878191219) for 500M EUR as of September 6, 2018. Tradable at Luxembourg Stock Exchange as of September 18, 2018.

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Amadeus IT Group Bond 0.875% 2023-03 EUR

Update! New bond issue: Amadeus IT Group (BME:AMS) issued new debt notes (XS1878191052) for 500M EUR as of September 6, 2018. Tradable at Luxembourg Stock Exchange as of September 18, 2018.

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Amadeus IT Group Bond VR% 2022-03 EUR

Update! New bond issue: Amadeus IT Group (BME:AMS) issued new debt notes (XS1878190757) for 500M EUR as of September 6, 2018. Tradable at Luxembourg Stock Exchange as of September 18, 2018.

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Hewlett Packard Enterprise Bond 3.50% 2021-10 USD

Update! New bond issue: Hewlett Packard Enterprise (NYSE:HPQ) issued new debt notes (US42824CBC29, 42824CBC2) for 500M USD as of September 10, 2018. Tradable at TRACE OTC as of September 11, 2018. Listed at Stuttgart Stock Exchange as of September 14, 2018.

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